Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface

Semiconductor products utilized in the automotive application need to be in high quality and more robust to ensure safe driving for the user. Thus, the semiconductor product manufacturers are moving toward zero defects target to gain the upper hand of the automotive market. One of the targets is to...

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書目詳細資料
主要作者: Yeo, Kian Hong
格式: Thesis
語言:English
English
出版: 2016
主題:
在線閱讀:http://eprints.utem.edu.my/id/eprint/21028/1/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20%20substrate%20interface.pdf
http://eprints.utem.edu.my/id/eprint/21028/2/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20substrate%20interface.pdf
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