Yeo, K. H. (2016). Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface.
Chicago Style (17th ed.) CitationYeo, Kian Hong. Effect of Epoxy Nozzle Separation on Die Attach Adhesion at Chip / Substrate Interface. 2016.
MLA (8th ed.) CitationYeo, Kian Hong. Effect of Epoxy Nozzle Separation on Die Attach Adhesion at Chip / Substrate Interface. 2016.
Warning: These citations may not always be 100% accurate.