APA引文

Yeo, K. H. (2016). Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface.

Chicago Style (17th ed.) Citation

Yeo, Kian Hong. Effect of Epoxy Nozzle Separation on Die Attach Adhesion at Chip / Substrate Interface. 2016.

MLA引文

Yeo, Kian Hong. Effect of Epoxy Nozzle Separation on Die Attach Adhesion at Chip / Substrate Interface. 2016.

警告：這些引文格式不一定是100％准確.