Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
Semiconductor products utilized in the automotive application need to be in high quality and more robust to ensure safe driving for the user. Thus, the semiconductor product manufacturers are moving toward zero defects target to gain the upper hand of the automotive market. One of the targets is to...
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | English English |
| منشور في: |
2016
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.utem.edu.my/id/eprint/21028/1/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20%20substrate%20interface.pdf http://eprints.utem.edu.my/id/eprint/21028/2/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20substrate%20interface.pdf |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
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الانترنت
http://eprints.utem.edu.my/id/eprint/21028/1/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20%20substrate%20interface.pdfhttp://eprints.utem.edu.my/id/eprint/21028/2/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20substrate%20interface.pdf