Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface
Semiconductor products utilized in the automotive application need to be in high quality and more robust to ensure safe driving for the user. Thus, the semiconductor product manufacturers are moving toward zero defects target to gain the upper hand of the automotive market. One of the targets is to...
Saved in:
| 主要作者: | |
|---|---|
| 格式: | Thesis |
| 語言: | English English |
| 出版: |
2016
|
| 主題: | |
| 在線閱讀: | http://eprints.utem.edu.my/id/eprint/21028/1/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20%20substrate%20interface.pdf http://eprints.utem.edu.my/id/eprint/21028/2/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20substrate%20interface.pdf |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
因特網
http://eprints.utem.edu.my/id/eprint/21028/1/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20%20substrate%20interface.pdfhttp://eprints.utem.edu.my/id/eprint/21028/2/Effect%20of%20epoxy%20nozzle%20separation%20on%20die%20attach%20adhesion%20at%20chip%20substrate%20interface.pdf