Improvement of change glue schedule down time at lid attachment process for semiconductor devices
This research report presents the work done on the improvement of change glue schedule down time at lid attachment process for semiconductor devices. Lid attachment is the end of line process for Plastic Dual Small Outline Flat (PDSOF) package which is one of the semiconductor devices. The process...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English English |
| Published: |
2017
|
| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/23785/1/Improvement%20Of%20Change%20Glue%20Schedule%20Down%20Time%20At%20Lid%20Attachment%20Process%20For%20Semiconductor%20Devices%20-%20Rozeana%20Abd%20Rahman%20-%2024%20Pages.pdf http://eprints.utem.edu.my/id/eprint/23785/2/Improvement%20of%20change%20glue%20schedule%20down%20time%20at%20lid%20attachment%20process%20for%20semiconductor%20devices.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Internet
http://eprints.utem.edu.my/id/eprint/23785/1/Improvement%20Of%20Change%20Glue%20Schedule%20Down%20Time%20At%20Lid%20Attachment%20Process%20For%20Semiconductor%20Devices%20-%20Rozeana%20Abd%20Rahman%20-%2024%20Pages.pdfhttp://eprints.utem.edu.my/id/eprint/23785/2/Improvement%20of%20change%20glue%20schedule%20down%20time%20at%20lid%20attachment%20process%20for%20semiconductor%20devices.pdf