Elimination of gold tarnish by post dip after gold plating process in flexible printed circuit board manufacturing
Flexible printed circuits (FPC) industry has high growth rate and high competition. FPC manufacturer should always ensure tighter tolerance to produce the highest quality of output products to their important and fulfill customer's high quality demand. Gold plating is often used in the electron...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English English |
| Published: |
2018
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/23959/1/Elimination%20Of%20Gold%20Tarnish%20By%20Post%20Dip%20After%20Gold%20Plating%20Process%20In%20Flexible%20Printed%20Circuit%20Board%20Manufacturing.pdf http://eprints.utem.edu.my/id/eprint/23959/2/Elimination%20of%20gold%20tarnish%20by%20post%20dip%20after%20gold%20plating%20process%20in%20flexible%20printed%20circuit%20board%20manufacturing.pdf |
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http://eprints.utem.edu.my/id/eprint/23959/1/Elimination%20Of%20Gold%20Tarnish%20By%20Post%20Dip%20After%20Gold%20Plating%20Process%20In%20Flexible%20Printed%20Circuit%20Board%20Manufacturing.pdfhttp://eprints.utem.edu.my/id/eprint/23959/2/Elimination%20of%20gold%20tarnish%20by%20post%20dip%20after%20gold%20plating%20process%20in%20flexible%20printed%20circuit%20board%20manufacturing.pdf