A crystallographic optimization study in Ta TaN bi-layer sputtering to reduce semiconductor manufacturing queue time constraint
The Physical Vapor Deposition (PVD) magnetron sputtering method is the most extensively used technique for depositing metallic thin film in the semiconductor wafer fabrication industry. The PVD equipment manufacturer has specified stringent control, in this case, a queue time restriction between the...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2022
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/26909/1/A%20crystallographic%20optimization%20study%20in%20Ta%20TaN%20bi-layer%20sputtering%20to%20reduce%20semiconductor%20manufacturing%20queue%20time%20constraint.pdf http://eprints.utem.edu.my/id/eprint/26909/2/A%20crystallographic%20optimization%20study%20in%20Ta%20TaN%20bi-layer%20sputtering%20to%20reduce%20semiconductor%20manufacturing%20queue%20time%20constraint.pdf |
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http://eprints.utem.edu.my/id/eprint/26909/1/A%20crystallographic%20optimization%20study%20in%20Ta%20TaN%20bi-layer%20sputtering%20to%20reduce%20semiconductor%20manufacturing%20queue%20time%20constraint.pdfhttp://eprints.utem.edu.my/id/eprint/26909/2/A%20crystallographic%20optimization%20study%20in%20Ta%20TaN%20bi-layer%20sputtering%20to%20reduce%20semiconductor%20manufacturing%20queue%20time%20constraint.pdf