Study and analysis of surface charge collection and emission spectrum of plasma ashing process

This research presents an important observation on the total surface charge collection using quantox wafers through the measurement of surface voltage (Vs) on wafer surface with contactless Kelvin Probe for changes in parameters during plasma ashing. In this report, it is covered on the plasma chara...

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Main Author:	Sivapathy, Kanthaan
Format:	Thesis
Language:	English English English
Published:	2019
Subjects:	QD450-801 Physical and theoretical chemistry
Online Access:	http://eprints.uthm.edu.my/533/1/24p%20KANTHAAN%20SIVAPATHY.pdf http://eprints.uthm.edu.my/533/2/KANTHAAN%20SIVAPATHY%20COPYRIGHT%20DECLARATION.pdf http://eprints.uthm.edu.my/533/3/KANTHAAN%20SIVAPATHY%20WATERMARK.pdf
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spelling	my-uthm-ep.5332021-07-26T01:11:06Z Study and analysis of surface charge collection and emission spectrum of plasma ashing process 2019-08 Sivapathy, Kanthaan QD450-801 Physical and theoretical chemistry This research presents an important observation on the total surface charge collection using quantox wafers through the measurement of surface voltage (Vs) on wafer surface with contactless Kelvin Probe for changes in parameters during plasma ashing. In this report, it is covered on the plasma characteristics and performance using the optical emission spectroscopy (OES) measurement, the study on how processing condition change can impact the total surface charge collection and also the uniformity of the charges on the wafer surface, using the quantox measurement. In this study, 3 different types of ashers are tested with varying 5 processing parameters, which where the process time, pressure, gas flow, power and temperature. It is seen that changes in the condition of these parameters do impact on the total surface charge collection and also the uniformity of the charges on the wafer surface. Based on the processing conditions, it is observed that Inductively-Coupled Plasma (ICP) asher model is better in terms of total surface charge collection and uniformity compared to Barrel asher model, which has lower total charge collection but with higher non-uniformity due to the machine chamber configuration. On the other hand, Helical Resonator Plasma (HRP) asher model contributes to higher total surface charge collection with the lesser uniformity, which could potential contribute to plasma induced damage (PID). 2019-08 Thesis http://eprints.uthm.edu.my/533/ http://eprints.uthm.edu.my/533/1/24p%20KANTHAAN%20SIVAPATHY.pdf text en public http://eprints.uthm.edu.my/533/2/KANTHAAN%20SIVAPATHY%20COPYRIGHT%20DECLARATION.pdf text en staffonly http://eprints.uthm.edu.my/533/3/KANTHAAN%20SIVAPATHY%20WATERMARK.pdf text en validuser mphil masters Universiti Tun Hussein Onn Malaysia Fakulti Kejuruteraan Elektrik dan Elektronik
institution	Universiti Tun Hussein Onn Malaysia
collection	UTHM Institutional Repository
language	English English English
topic	QD450-801 Physical and theoretical chemistry
spellingShingle	QD450-801 Physical and theoretical chemistry Sivapathy, Kanthaan Study and analysis of surface charge collection and emission spectrum of plasma ashing process
description	This research presents an important observation on the total surface charge collection using quantox wafers through the measurement of surface voltage (Vs) on wafer surface with contactless Kelvin Probe for changes in parameters during plasma ashing. In this report, it is covered on the plasma characteristics and performance using the optical emission spectroscopy (OES) measurement, the study on how processing condition change can impact the total surface charge collection and also the uniformity of the charges on the wafer surface, using the quantox measurement. In this study, 3 different types of ashers are tested with varying 5 processing parameters, which where the process time, pressure, gas flow, power and temperature. It is seen that changes in the condition of these parameters do impact on the total surface charge collection and also the uniformity of the charges on the wafer surface. Based on the processing conditions, it is observed that Inductively-Coupled Plasma (ICP) asher model is better in terms of total surface charge collection and uniformity compared to Barrel asher model, which has lower total charge collection but with higher non-uniformity due to the machine chamber configuration. On the other hand, Helical Resonator Plasma (HRP) asher model contributes to higher total surface charge collection with the lesser uniformity, which could potential contribute to plasma induced damage (PID).
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Sivapathy, Kanthaan
author_facet	Sivapathy, Kanthaan
author_sort	Sivapathy, Kanthaan
title	Study and analysis of surface charge collection and emission spectrum of plasma ashing process
title_short	Study and analysis of surface charge collection and emission spectrum of plasma ashing process
title_full	Study and analysis of surface charge collection and emission spectrum of plasma ashing process
title_fullStr	Study and analysis of surface charge collection and emission spectrum of plasma ashing process
title_full_unstemmed	Study and analysis of surface charge collection and emission spectrum of plasma ashing process
title_sort	study and analysis of surface charge collection and emission spectrum of plasma ashing process
granting_institution	Universiti Tun Hussein Onn Malaysia
granting_department	Fakulti Kejuruteraan Elektrik dan Elektronik
publishDate	2019
url	http://eprints.uthm.edu.my/533/1/24p%20KANTHAAN%20SIVAPATHY.pdf http://eprints.uthm.edu.my/533/2/KANTHAAN%20SIVAPATHY%20COPYRIGHT%20DECLARATION.pdf http://eprints.uthm.edu.my/533/3/KANTHAAN%20SIVAPATHY%20WATERMARK.pdf
_version_	1747830632431484928

Study and analysis of surface charge collection and emission spectrum of plasma ashing process

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