The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON S...
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| Format: | Thesis |
| Language: | English |
| Published: |
2004
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| Online Access: | http://eprints.uthm.edu.my/7636/1/24p%20CHUA%20KING%20LEE.pdf |
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