The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging

The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON S...

Full description

Saved in:

Bibliographic Details
Main Author:	Chua, King Lee
Format:	Thesis
Language:	English
Published:	2004
Subjects:	TK Electrical engineering Electronics Nuclear engineering TK7800-8360 Electronics
Online Access:	http://eprints.uthm.edu.my/7636/1/24p%20CHUA%20KING%20LEE.pdf
Tags:	Add Tag No Tags, Be the first to tag this record!

id	my-uthm-ep.7636
record_format	uketd_dc
spelling	my-uthm-ep.76362022-09-08T02:12:53Z The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging 2004-03 Chua, King Lee TK Electrical engineering. Electronics Nuclear engineering TK7800-8360 Electronics The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON Semiconductor where silver-filler epoxy�based adhesive chips were investigated. Tektronix 370B Programmable Curve Tracer with picoprobing is used to measure RoN of the chips. Nondestructive techniques such as X-ray and SAM used to examine internal defect and cross sectional analysis was done using SEM. Few factors were found affect RoN. Those factors are capacitance due to trap charges during fabrication, supply voltage, thermal management of the package, delamination between die attachments, thickness of the epox)' and copper dioxide of the lead-frame. 2004-03 Thesis http://eprints.uthm.edu.my/7636/ http://eprints.uthm.edu.my/7636/1/24p%20CHUA%20KING%20LEE.pdf text en public mphil masters Universiti Kebangsaan Malaysia Fakulti Kejuruteraan Elektrik, Elektronik dan Sistem
institution	Universiti Tun Hussein Onn Malaysia
collection	UTHM Institutional Repository
language	English
topic	TK Electrical engineering Electronics Nuclear engineering TK7800-8360 Electronics
spellingShingle	TK Electrical engineering Electronics Nuclear engineering TK7800-8360 Electronics Chua, King Lee The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
description	The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON Semiconductor where silver-filler epoxy�based adhesive chips were investigated. Tektronix 370B Programmable Curve Tracer with picoprobing is used to measure RoN of the chips. Nondestructive techniques such as X-ray and SAM used to examine internal defect and cross sectional analysis was done using SEM. Few factors were found affect RoN. Those factors are capacitance due to trap charges during fabrication, supply voltage, thermal management of the package, delamination between die attachments, thickness of the epox)' and copper dioxide of the lead-frame.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Chua, King Lee
author_facet	Chua, King Lee
author_sort	Chua, King Lee
title	The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
title_short	The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
title_full	The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
title_fullStr	The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
title_full_unstemmed	The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
title_sort	investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
granting_institution	Universiti Kebangsaan Malaysia
granting_department	Fakulti Kejuruteraan Elektrik, Elektronik dan Sistem
publishDate	2004
url	http://eprints.uthm.edu.my/7636/1/24p%20CHUA%20KING%20LEE.pdf
_version_	1747831170741043200

The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging

Similar Items