Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
Due to increasing environmental and health concerns related to the toxicity of traditional tin-lead solders, lead-free solders appear as promising replacement for the eutectic solder alloy in flip chip technology. Then a surface finish is designed to protect the copper surface against oxidation as w...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2009
|
| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/10063/1/NurfazlinAbuHassanMFKM2009.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|