Characterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application
Through silicon via (TSV) is a structure through entire Si substrate that enables vertical electrical connections between chips. Recently, the electroless deposition of Cu using a chemical bath has received considerable attention as a promising technique for the TSV filling process. Even the advanta...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2019
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/101922/1/ShazatulAkmaliahMiorShahidinMSKM2019.pdf |
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