Simulasi suis optik menggunakan teknologi MEMs

MEMs or known as MicroElectromechanical System is first introduced in 1980s. This technology is a combination of sensors, mechanical and electronic elements. All of them are unite in single basic material (silicon) and fabricated using a micro-fabrication system. Two micro fabrication techniques are...

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Main Author:	Adon, Mohamad Nazib
Format:	Thesis
Language:	English
Published:	2006
Subjects:	TK Electrical engineering Electronics Nuclear engineering
Online Access:	http://eprints.utm.my/id/eprint/1384/1/MohamadNazibAdonMFKE2006.pdf
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id	my-utm-ep.1384
record_format	uketd_dc
spelling	my-utm-ep.13842018-02-20T04:24:29Z Simulasi suis optik menggunakan teknologi MEMs 2006-05 Adon, Mohamad Nazib TK Electrical engineering. Electronics Nuclear engineering MEMs or known as MicroElectromechanical System is first introduced in 1980s. This technology is a combination of sensors, mechanical and electronic elements. All of them are unite in single basic material (silicon) and fabricated using a micro-fabrication system. Two micro fabrication techniques are normally used, a bulk micro-machining and surfaced micro-machining technique. The latter technique is preferred due to advanced fabrication technique and its ability to construct complex mechanical structures. In this project, a CoventorWareâ„¢ software that is based on surfaced micro-machining technique is applied. In order to obtain an optimum design, a basic two dimensional (2D) design is done to identify the actual width, length and thickness of the MEMs device. The 2D design is then converted to three dimensional (3D) design where a boundary condition analysis is done. Four types of meshing analysis are adopted in CoventorWareâ„¢ which are surfaces, tetrahedron, Manhattan brick and extruded. The meshing analysis selection is based on simulation period together with the level of analysis correctness. In order to identify the existence of any capacitance and pressure effects on the developed design, the electrostatic and electromechanical analyses are carried out. Finally, analyses on the combined solutions of electrostatic and electromechanical analyses are done for the active device application 2006-05 Thesis http://eprints.utm.my/id/eprint/1384/ http://eprints.utm.my/id/eprint/1384/1/MohamadNazibAdonMFKE2006.pdf application/pdf en public masters Universiti Teknologi Malaysia, Faculty of Electrical Engineering Faculty of Electrical Engineering
institution	Universiti Teknologi Malaysia
collection	UTM Institutional Repository
language	English
topic	TK Electrical engineering Electronics Nuclear engineering
spellingShingle	TK Electrical engineering Electronics Nuclear engineering Adon, Mohamad Nazib Simulasi suis optik menggunakan teknologi MEMs
description	MEMs or known as MicroElectromechanical System is first introduced in 1980s. This technology is a combination of sensors, mechanical and electronic elements. All of them are unite in single basic material (silicon) and fabricated using a micro-fabrication system. Two micro fabrication techniques are normally used, a bulk micro-machining and surfaced micro-machining technique. The latter technique is preferred due to advanced fabrication technique and its ability to construct complex mechanical structures. In this project, a CoventorWareâ„¢ software that is based on surfaced micro-machining technique is applied. In order to obtain an optimum design, a basic two dimensional (2D) design is done to identify the actual width, length and thickness of the MEMs device. The 2D design is then converted to three dimensional (3D) design where a boundary condition analysis is done. Four types of meshing analysis are adopted in CoventorWareâ„¢ which are surfaces, tetrahedron, Manhattan brick and extruded. The meshing analysis selection is based on simulation period together with the level of analysis correctness. In order to identify the existence of any capacitance and pressure effects on the developed design, the electrostatic and electromechanical analyses are carried out. Finally, analyses on the combined solutions of electrostatic and electromechanical analyses are done for the active device application
format	Thesis
qualification_level	Master's degree
author	Adon, Mohamad Nazib
author_facet	Adon, Mohamad Nazib
author_sort	Adon, Mohamad Nazib
title	Simulasi suis optik menggunakan teknologi MEMs
title_short	Simulasi suis optik menggunakan teknologi MEMs
title_full	Simulasi suis optik menggunakan teknologi MEMs
title_fullStr	Simulasi suis optik menggunakan teknologi MEMs
title_full_unstemmed	Simulasi suis optik menggunakan teknologi MEMs
title_sort	simulasi suis optik menggunakan teknologi mems
granting_institution	Universiti Teknologi Malaysia, Faculty of Electrical Engineering
granting_department	Faculty of Electrical Engineering
publishDate	2006
url	http://eprints.utm.my/id/eprint/1384/1/MohamadNazibAdonMFKE2006.pdf
_version_	1747814375674085376

Simulasi suis optik menggunakan teknologi MEMs

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