Recipe generation of under fill process based on improved kernel regression and particle swarm optimization

The under fill process is a process that fills the gap between a chipset and a substrate using an epoxy material. The output of this process is a length of tongue that has to be controlled so it avoid touching the keep out zone. A recipe generation of the input parameters in the under fill process w...

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Bibliographic Details
Main Author: Othman, Mohd. Hafiz
Format: Thesis
Published: 2012
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