Thermal model for electronic components placement on printed circuit board
This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components wi...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/37974/1/AnwarMohdAbdMahiMFKE2013.pdf |
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