Mohd. Abd. Mahi, A. (2013). Thermal model for electronic components placement on printed circuit board.
Chicago Style (17th ed.) CitationMohd. Abd. Mahi, Anwar. Thermal Model for Electronic Components Placement on Printed Circuit Board. 2013.
MLA引文Mohd. Abd. Mahi, Anwar. Thermal Model for Electronic Components Placement on Printed Circuit Board. 2013.
警告:這些引文格式不一定是100%准確.