Thermal model for electronic components placement on printed circuit board

This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components wi...

全面介绍

Saved in:
书目详细资料
主要作者: Mohd. Abd. Mahi, Anwar
格式: Thesis
语言:English
出版: 2013
主题:
在线阅读:http://eprints.utm.my/id/eprint/37974/1/AnwarMohdAbdMahiMFKE2013.pdf
标签: 添加标签
没有标签, 成为第一个标记此记录!
实物特征
总结:This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components with lower power dissipation. This is done in order to control the overall temperature of the printed circuit board. This principle is different from fuzzy thermal method, where the placement of component is placed randomly on printed circuit board. The fitness function is then calculated to get the best placement. The fitness function is taking into consideration the minimization of area and the temperature. In order to get the best value of fitness function, the area function and the temperature function must minimum. Comparative analysis has been done to verify the results, which show that Fuzzy thermal method has perform 4% better than quadrisection method.