Thermal model for electronic components placement on printed circuit board
This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components wi...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/37974/1/AnwarMohdAbdMahiMFKE2013.pdf |
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| Summary: | This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components with lower power dissipation. This is done in order to control the overall temperature of the printed circuit board. This principle is different from fuzzy thermal method, where the placement of component is placed randomly on printed circuit board. The fitness function is then calculated to get the best placement. The fitness function is taking into consideration the minimization of area and the temperature. In order to get the best value of fitness function, the area function and the temperature function must minimum. Comparative analysis has been done to verify the results, which show that Fuzzy thermal method has perform 4% better than quadrisection method. |
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