Thermal model for electronic components placement on printed circuit board
This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components wi...
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my-utm-ep.379742018-04-12T05:39:32Z Thermal model for electronic components placement on printed circuit board 2013-06 Mohd. Abd. Mahi, Anwar TK Electrical engineering. Electronics Nuclear engineering This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components with lower power dissipation. This is done in order to control the overall temperature of the printed circuit board. This principle is different from fuzzy thermal method, where the placement of component is placed randomly on printed circuit board. The fitness function is then calculated to get the best placement. The fitness function is taking into consideration the minimization of area and the temperature. In order to get the best value of fitness function, the area function and the temperature function must minimum. Comparative analysis has been done to verify the results, which show that Fuzzy thermal method has perform 4% better than quadrisection method. 2013-06 Thesis http://eprints.utm.my/id/eprint/37974/ http://eprints.utm.my/id/eprint/37974/1/AnwarMohdAbdMahiMFKE2013.pdf application/pdf en public masters Universiti Teknologi Malaysia, Faculty of Electrical Engineering Faculty of Electrical Engineering |
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Universiti Teknologi Malaysia |
collection |
UTM Institutional Repository |
language |
English |
topic |
TK Electrical engineering Electronics Nuclear engineering |
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TK Electrical engineering Electronics Nuclear engineering Mohd. Abd. Mahi, Anwar Thermal model for electronic components placement on printed circuit board |
description |
This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components with lower power dissipation. This is done in order to control the overall temperature of the printed circuit board. This principle is different from fuzzy thermal method, where the placement of component is placed randomly on printed circuit board. The fitness function is then calculated to get the best placement. The fitness function is taking into consideration the minimization of area and the temperature. In order to get the best value of fitness function, the area function and the temperature function must minimum. Comparative analysis has been done to verify the results, which show that Fuzzy thermal method has perform 4% better than quadrisection method. |
format |
Thesis |
qualification_level |
Master's degree |
author |
Mohd. Abd. Mahi, Anwar |
author_facet |
Mohd. Abd. Mahi, Anwar |
author_sort |
Mohd. Abd. Mahi, Anwar |
title |
Thermal model for electronic components placement on printed circuit board |
title_short |
Thermal model for electronic components placement on printed circuit board |
title_full |
Thermal model for electronic components placement on printed circuit board |
title_fullStr |
Thermal model for electronic components placement on printed circuit board |
title_full_unstemmed |
Thermal model for electronic components placement on printed circuit board |
title_sort |
thermal model for electronic components placement on printed circuit board |
granting_institution |
Universiti Teknologi Malaysia, Faculty of Electrical Engineering |
granting_department |
Faculty of Electrical Engineering |
publishDate |
2013 |
url |
http://eprints.utm.my/id/eprint/37974/1/AnwarMohdAbdMahiMFKE2013.pdf |
_version_ |
1747816516472012800 |