Thermal model for electronic components placement on printed circuit board

This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components wi...

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Main Author:	Mohd. Abd. Mahi, Anwar
Format:	Thesis
Language:	English
Published:	2013
Subjects:	TK Electrical engineering Electronics Nuclear engineering
Online Access:	http://eprints.utm.my/id/eprint/37974/1/AnwarMohdAbdMahiMFKE2013.pdf
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id	my-utm-ep.37974
record_format	uketd_dc
spelling	my-utm-ep.379742018-04-12T05:39:32Z Thermal model for electronic components placement on printed circuit board 2013-06 Mohd. Abd. Mahi, Anwar TK Electrical engineering. Electronics Nuclear engineering This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components with lower power dissipation. This is done in order to control the overall temperature of the printed circuit board. This principle is different from fuzzy thermal method, where the placement of component is placed randomly on printed circuit board. The fitness function is then calculated to get the best placement. The fitness function is taking into consideration the minimization of area and the temperature. In order to get the best value of fitness function, the area function and the temperature function must minimum. Comparative analysis has been done to verify the results, which show that Fuzzy thermal method has perform 4% better than quadrisection method. 2013-06 Thesis http://eprints.utm.my/id/eprint/37974/ http://eprints.utm.my/id/eprint/37974/1/AnwarMohdAbdMahiMFKE2013.pdf application/pdf en public masters Universiti Teknologi Malaysia, Faculty of Electrical Engineering Faculty of Electrical Engineering
institution	Universiti Teknologi Malaysia
collection	UTM Institutional Repository
language	English
topic	TK Electrical engineering Electronics Nuclear engineering
spellingShingle	TK Electrical engineering Electronics Nuclear engineering Mohd. Abd. Mahi, Anwar Thermal model for electronic components placement on printed circuit board
description	This dissertation is regarding the fuzzy-thermal method for the placement of electronic components on a printed circuit board. In the conventional quadrisection placement method, the placement is according to components with higher power dissipation will be placed separately from other components with lower power dissipation. This is done in order to control the overall temperature of the printed circuit board. This principle is different from fuzzy thermal method, where the placement of component is placed randomly on printed circuit board. The fitness function is then calculated to get the best placement. The fitness function is taking into consideration the minimization of area and the temperature. In order to get the best value of fitness function, the area function and the temperature function must minimum. Comparative analysis has been done to verify the results, which show that Fuzzy thermal method has perform 4% better than quadrisection method.
format	Thesis
qualification_level	Master's degree
author	Mohd. Abd. Mahi, Anwar
author_facet	Mohd. Abd. Mahi, Anwar
author_sort	Mohd. Abd. Mahi, Anwar
title	Thermal model for electronic components placement on printed circuit board
title_short	Thermal model for electronic components placement on printed circuit board
title_full	Thermal model for electronic components placement on printed circuit board
title_fullStr	Thermal model for electronic components placement on printed circuit board
title_full_unstemmed	Thermal model for electronic components placement on printed circuit board
title_sort	thermal model for electronic components placement on printed circuit board
granting_institution	Universiti Teknologi Malaysia, Faculty of Electrical Engineering
granting_department	Faculty of Electrical Engineering
publishDate	2013
url	http://eprints.utm.my/id/eprint/37974/1/AnwarMohdAbdMahiMFKE2013.pdf
_version_	1747816516472012800

Thermal model for electronic components placement on printed circuit board

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