Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
In flip chip interconnection an under bump metallurgy (UBM) is required to provide a diffusion barrier, an adhesion and a solderable surface. Among the various UBM systems available the electroless nickel / immersion gold (ENIG) has received greater attention in recent years due to its low cost and...
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| 主要作者: | |
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| 格式: | Thesis |
| 語言: | English |
| 出版: |
2003
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| 主題: | |
| 在線閱讀: | http://eprints.utm.my/id/eprint/4392/1/TaiSiewFongMFKM2003.pdf |
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