A unified constitutive model for solder materials
Solder joint reliability has been the main concern in electronic packaging since the advent of surface mount technology. In this study, a unified constitutive model was developed for finite element analysis of solder joint reliability. The model is based on the Anand model and Runge-Kutta time integ...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2004
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/5108/1/KohYeeKanMFKM2004.pdf |
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