An experimental investigation on partial-ductile mode grinding of silicon
This research work was primarily concentrated on precise ductile-mode grinding (milling) of flat surfaces of silicon, mainly Integrated Circuit (IC) silicon chips (dies), which were about 700 µm thick and the top of their surfaces covered with a silicon nitride layer. Substantial amount of partial-...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2002
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| Online Access: | http://eprints.utm.my/id/eprint/6867/1/MohamedKonnehPFKM2002_AnExperimentalInvestigationonPartial-DuctileModeGrinding.pdf |
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