Electrodeposition and characterization of SN-BI lead-free soldier alloys /

مواد مشابهة

• The electrical properties of element-added (FE, AL) lead-free solder alloys : experimental and materials modeling approaches /
  بواسطة: Nur'aishah Aminah Mohd Amin
  منشور في: (2015)
• Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
  بواسطة: Chew, Chee Sean
  منشور في: (2011)
• Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate /
  بواسطة: Ghosh, Sujan Kumer
  منشور في: (2015)
• Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
  بواسطة: Muhammad Hafiz, Zan @ Hazizi
• Development of high-temperature lead-free solder for semiconductor chip attachment /
  بواسطة: Haque, Ashraful
  منشور في: (2011)