Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /

Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /

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书目详细资料
主要作者:	Low, Pui Leng (Author)
格式:	Thesis 图书
语言:	English
出版:	2020
主题:	Microelectronic packaging > Materials. Sintering. Curing > Equipment and supplies.
在线阅读:	http://studentsrepo.um.edu.my/11482/
标签:	添加标签没有标签, 成为第一个标记此记录!

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