Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /

Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /

Saved in:

書目詳細資料
主要作者:	Low, Pui Leng (Author)
格式:	Thesis 圖書
語言:	English
出版:	2020
主題:	Microelectronic packaging > Materials. Sintering. Curing > Equipment and supplies.
在線閱讀:	http://studentsrepo.um.edu.my/11482/
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

相似書籍

Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /
由: Shutesh Krishnan
出版: (2007)

Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
由: Tolentino, Erik Nino
出版: (2020)

Development of non-post mold cure alternative for semiconductor packaging /
由: Tan, Sook Wai
出版: (1997)

Material characterization of soft solder die attaches for power ICs /
由: Wee, Seng Kee
出版: (1996)

A study of wire bonded Cu-A1 in microelectronics packaging /
由: Tan, Chee Wei
出版: (2002)

A study of copper oxide-zirconia produced by conventional and pressureless two-step sintering process /
由: Chee, Alexander Hon Cheong
出版: (2021)

Improvement on the ball attach process of BGA packages /
由: Thiaga Rajan Muthusamy
出版: (1999)

Package cracking mechanism in plastic encapsulated integrated circuit devices /
由: Tan, Geok Leong
出版: (1993)

Study of alternative packaging materials for semiconductor devices /
由: Suprammaniam, Sugumar
出版: (1997)

Microstructural characterization of pressureless sintered silver die attached material
由: Esa, Siti Rahmah
出版: (2022)

A study of wire sweep during transfer molding on plastic IC packaging /
由: Wu, Jianhua
出版: (1996)

The effect of silica on the cure kinetics of epoxy resin with aromatic diamines /
由: Wong, Juliana K.C
出版: (1997)

Microwave radiation curing of epoxy/diamine systems /
由: Yap, Boon Huey
出版: (1997)

Kinetic growth of copper oxidation in semiconductor packaging /
由: Siti Rahmah Esa
出版: (2017)

Pulsed-laser deposition of microelectronics films /
由: Lu, Liwen
出版: (1999)

Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging
由: Dharmalingam, Sivakumar
出版: (2004)

A study of curing process optimisation for manufacturing of polyurethane enamelled copper wire /
由: Sim, Weng Kee
出版: (2009)

The effect of different sintering temperature to the properties of cow bone hydroxyapatite
由: Shahrizal, Md Hussein

Response surface methodology for optimization of sintering process for preparation of ZnO low voltage varistor
由: Moosavi, Seyedehmaryam
出版: (2014)

Microwave hybrid sintering for tin-base alloy /
由: Tan, Meow Min
出版: (2009)

Development of high-temperature lead-free solder for semiconductor chip attachment /
由: Haque, Ashraful
出版: (2011)

Microwave sintering of a tin base alloy /
由: Azrena Haji Abu Bakar
出版: (2005)

Microwave and conventional sintering of manganese-doped alumina : densification and mechanical properties /
由: Dhuban, Salem Omar Abdullah
出版: (2019)

Sintering of compacted Zn powder via a modified microwave oven /
由: Azrina Arshad
出版: (2010)

Colloidal processing and sintering of narrow-size-distribution submicron alumina /
由: Wong, Pomp Meng
出版: (1991)

Carbonation of concrete /
由: Chin, Mee Shian
出版: (1991)

Sintering behaviour and properties of graphene oxide-doped Y-TZP ceramics /
由: Khan, Mohammad Mohaymen
出版: (2017)

Effect of particle size distribution on sintering of sub-micron alumina powder compacts /
由: Ma, Jan
出版: (1992)

Comparative study of microwave and conventional sintering on properties of zirconia /
由: Nurhusna Zulkifli
出版: (2018)

Effects of sintering atmosphere and temperature on physical properties of mullite-based ceramic from black rice husk ash and alumina mixture
由: Mohamed, Nurzilla
出版: (2014)

Fabrication and characterization of microwave sintered PM Fe-Cr-Y2O3 composite
由: Marina, Marzuki

Spark plasma sintered hydroxyapatite/bioglass composite for improved biological performance /
由: Rizwan, Muhammad
出版: (2019)

Carbonation of concrete /
由: Aung, Toe Toe
出版: (1993)

The effects of sintering additives on the mechanical properties and microstructure evolution of 3 MOL% Y-TZP /
由: Nur Nadia Ahmad Hasan
出版: (2018)

Effects of sintering temperature on microstructure and complex permittivity of magnesium titanate-doped barium strontium titanate prepared via mechanical alloying
由: Abdul Halim, Dayang Nur Fazliana
出版: (2018)

Investigation of mechanical properties of paper-based packaging materials /
由: Masni-Azian Akiah
出版: (2011)

Hybrid microwave sintering of zinc aluminum alloy /
由: Maisarah Lutfi
出版: (2012)

Sintering behaviour and mechanical properties of synthesized hydroxyapatite bioceramics /
由: Tan, Chou Yong
出版: (2008)

Delamination propagation in plastic IC packages during solder reflow /
由: Ma, Yiyi
出版: (1999)

Comparison of mechanical properties of hydroxyapatite derived from different additive powders with conventional sintering /
由: See, Kwan Wern
出版: (2018)

Services hosted by the Perpustakaan Sultan Abdul Samad, Universiti Putra Malaysia with Cooperation MySyL Group