Development of non-post mold cure alternative for semiconductor packaging /

مواد مشابهة

• Study of alternative packaging materials for semiconductor devices /
  بواسطة: Suprammaniam, Sugumar
  منشور في: (1997)
• The effect of silica on the cure kinetics of epoxy resin with aromatic diamines /
  بواسطة: Wong, Juliana K.C
  منشور في: (1997)
• Package cracking mechanism in plastic encapsulated integrated circuit devices /
  بواسطة: Tan, Geok Leong
  منشور في: (1993)
• Microwave radiation curing of epoxy/diamine systems /
  بواسطة: Yap, Boon Huey
  منشور في: (1997)
• Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
  بواسطة: Low, Pui Leng
  منشور في: (2020)