Hygrothermally-induced delamination and cracking in plastic IC packages /

Hygrothermally-induced delamination and cracking in plastic IC packages /

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書目詳細資料
主要作者:	Lin, Tingyu
格式:	Thesis 圖書
語言:	English
出版:	1999.
主題:	Plastics in packaging > Fracture Plastics > Permeability > Testing
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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