Zincation pretreatment for electroless nickel underbump metallurgy in microelectronics packaging /

مواد مشابهة

• Electrodeposition Of Nickel Coatings On Aluminium Alloy 7075 Through A Modified Single Zincating Process
  بواسطة: Othman, Intan Sharhida
  منشور في: (2016)
• Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /
  بواسطة: Shutesh Krishnan
  منشور في: (2007)
• Electroless deposition of nickel from acid solution /
  بواسطة: Chin, Swee Yee
  منشور في: (2006)
• A study of wire bonded Cu-A1 in microelectronics packaging /
  بواسطة: Tan, Chee Wei
  منشور في: (2002)
• Surface modification and metallization of a polyimide for microelectronic package /
  بواسطة: Yu, Weixing
  منشور في: (2001)