Study of interconnect reliability in BGA packging /

Study of interconnect reliability in BGA packging /

Saved in:

书目详细资料
主要作者:	Seah, Simon Kah Woon
格式:	Thesis 图书
语言:	English
出版:	2002.
标签:	添加标签没有标签, 成为第一个标记此记录!

相似书籍

A reliability methodology for deep sub-micron interconnect metal liners /
由: Wong, Poh Ling
出版: (2005)

Solder Joint Reliability Of Flip Chip BGA Package
由: Lee, Kor Oon
出版: (2004)

Investigation of the quality and reliability of copper interconnects /
由: Koh, Leong Tee
出版: (2000)

A resistance-noise model for the investigation of interconnect voiding and reliability /
由: Chu, Lip Wei
出版: (2001)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
由: Muhammad Nubli, Zulkifli

Integrating replicated network with looping method for multistage interconnection network reliability
由: Md Yunus, Nur Arzilawati
出版: (2022)

Improvement on the ball attach process of BGA packages /
由: Thiaga Rajan Muthusamy
出版: (1999)

Damage mechanics-based model for reliability assessment of through-silicon via interconnects
由: Afripin, Mohammad Amirul Affiz
出版: (2020)

Modeling and prediction of software reliability /
由: Guo, Huairui
出版: (2002)

Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints
由: Leong, Kum Foo
出版: (2003)

Ultra-thin gate oxide reliability /
由: Ang, Chew Hoe
出版: (2000)

Pengukuran tahap kepuasan pelanggan dalam industri perkilangan . Kajian kes di Amcor Fibre Packging (M) Sdn Bhd Senai Johor.
由: Ee, Khor Chen
出版: (2004)

Analysing reliability problems in concurrent fast product development processes /
由: Lu, Yuan
出版: (2002)

Reliability testing and heat transfer enhancement of organic phase change materials /
由: Sharma, Ravi Kumar
出版: (2016)

Temperature cycling test for a Ball Grid Array (BGA) package using finite element analysis (FEA)
由: Muhammad Nubli, Zulkifli

Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /
由: Zainudin Kornain
出版: (2012)

Constructing graphs for interconnection network topologies /
由: Lee, Meng Chua
出版: (1988)

Interconnect delay and routing in nanometer VLSI
由: Kuay, Chong Lee
出版: (2008)

Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /
由: Ibrahim Ahmad
出版: (2007)

Interconnecting outriggers system in tall building structure
由: Nasr, Ali Hadian
出版: (2014)

Hierarchical voltage control strategy in interconnected power systems
由: Zainal Abidin, Mohd. Fhirdaus
出版: (2013)

QYPS HPS Interconnect verification methodology for SOC FPGA
由: Loh , Tat Jen
出版: (2013)

Modeling and simulation of interconnected wireless/wired ATM networks /
由: Tong, Mei
出版: (1998)

Integration of damage-based models for fatigue of solder interconnects
由: Mohd. Shaffiar, Norhashimah
出版: (2012)

Optimal modeling fill guide for improved interconnect performance
由: Yeo, Joel Yee Kiat
出版: (2012)

A study of confined vortex breakdown in cylindrical and conical cavities /
由: Seah, Robert Kwan Meng
出版: (2001)

Characterization and reliability investigatigation of eeprom tunnel oxide /
由: Lai, Kah Keen
出版: (2001)

A study of new product development, ("intrapreneurship"), in manufacturing companies in Singapore /
由: Woon, Lee Huat
出版: (2000)

Zero Algorithms for Avoiding Crosstalk in Optical Multistage Interconnection Network
由: Ali Al-Shabi, Mohammed Abdulhameed
出版: (2005)

Bitwise-based Routing Algorithms in Optical Multistage Interconnection Network
由: Abed, Farzaneh
出版: (2007)

Coordinating protection schemes for the interconnection of embedded generator to utility network /
由: Leo, Pui Yong
出版: (2009)

Interconnection and damping assignment passivity based controller for multilevel inverter
由: Nur Huda, Ramlan
出版: (2017)

Interconnection and damping assignment passivity-based controller for multilevel inverter
由: Ramlan, Nur Huda
出版: (2017)

Outrigger system for interconnecting three dimensional multi-stories buildings
由: Teck Shin, Lee
出版: (2014)

Outrigger system for interconnecting three dimensional multi-stories buildings
由: Lee, Teck Shin
出版: (2014)

Characterization of a low dielectric constant material for multilevel interconnects /
由: Wang, Cuiyang
出版: (1999)

Integration of Cu interconnects for sub-0.25 um manufacturing /
由: Yap, Kuan Pei
出版: (1999)

OSI software development for interconnected heterogeneous local area networks /
由: Ang, Wilson Choon Kee
出版: (1988)

The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
由: Ghazali Omar
出版: (2005)

Crosstalk-Free Scheduling Algorithms for Routing in Optical Multistage Interconnection Networks
由: Raja Mohd Auzar, Tengku Dian Shahida
出版: (2009)

Services hosted by the Perpustakaan Sultan Abdul Samad, Universiti Putra Malaysia with Cooperation MySyL Group