A reliability methodology for deep sub-micron interconnect metal liners /

A reliability methodology for deep sub-micron interconnect metal liners /

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書目詳細資料
主要作者:	Wong, Poh Ling
格式:	Thesis 圖書
語言:	English
出版:	2005.
主題:	Electrodiffusion. Copper > Electric properties.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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