The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2009.
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| LEADER | 01170cam a2200277 a 4500 | ||
|---|---|---|---|
| 001 | u784903 | ||
| 003 | SIRSI | ||
| 005 | 201001181648 | ||
| 008 | 100118s2009 my t 000 0 eng m | ||
| 040 | |a UMM |d UMJ | ||
| 090 | |a TS176 |b UM 2009 Ang | ||
| 097 | |a TS176 |b UM 2009 Ang | ||
| 100 | 1 | |a Angellia, Lian Dewi. | |
| 245 | 1 | 4 | |a The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder / |c Lian Dewi Angellia. |
| 260 | |c 2009. | ||
| 300 | |a xii, 82 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M. Eng. (Manuf.)) -- Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan, Universiti Malaya, 2009. | ||
| 504 | |a Bibliography: leaves 79-82. | ||
| 650 | 0 | |a Copper powder. | |
| 650 | 0 | |a Solder and soldering. | |
| 650 | 0 | |a Microstructure. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Rekabentuk dan Pembuatan. | |
| 900 | |a ZSA-ZA | ||
| 596 | |a 1 7 | ||
| 999 | |a TS176 UM 2009 ANG |w LC |c 1 |i A513763305 |d 28/4/2015 |e 28/4/2015 |f 29/3/2010 |g 1 |l STACKS |m P01UTAMA |n 8 |r Y |s Y |t TESIS |u 29/3/2010 | ||
| 999 | |a TS176 UM 2009 ANG |w LC |c 1 |i A510817557 |d 28/4/2010 |f 28/4/2010 |g 2 |l STACKS |m P07JURUTER |r Y |s Y |t TESIS |u 22/4/2010 | ||