The effects of annealing, temperature and humidity on tin whiskers formation /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2009.
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| Subjects: | |
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| LEADER | 01135cam a2200277 a 4500 | ||
|---|---|---|---|
| 001 | u785762 | ||
| 003 | SIRSI | ||
| 005 | 201001281715 | ||
| 008 | 100128s2009 my t 000 0 eng m | ||
| 040 | |a UMM |d UMJ | ||
| 090 | |a TS176 |b UM 2009 Lee | ||
| 097 | |a TS176 |b UM 2009 Lee | ||
| 100 | 1 | |a Lee, Hua Xing. | |
| 245 | 1 | 4 | |a The effects of annealing, temperature and humidity on tin whiskers formation / |c Lee Hua Xing. |
| 260 | |c 2009. | ||
| 300 | |a xv,136 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng. (Manuf.)) -- Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan, Universiti Malaya, 2009. | ||
| 504 | |a Bibliography: leaves 101-106. | ||
| 650 | 0 | |a Semiconductors |x Heat treatment. | |
| 650 | 0 | |a Thermoelectric materials. | |
| 650 | 0 | |a Electronic packaging. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Rekabentuk dan Pembuatan. | |
| 900 | |a NAR-ZA | ||
| 596 | |a 1 7 | ||
| 999 | |a TS176 UM 2009 LEE |w LC |c 1 |i A513496658 |d 26/5/2010 |f 26/5/2010 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 26/5/2010 | ||
| 999 | |a TS176 UM 2009 LEE |w LC |c 1 |i A513407556 |d 7/6/2010 |f 7/6/2010 |g 1 |l STACKS |m P07JURUTER |r Y |s Y |t TESIS |u 4/6/2010 | ||