Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /

مواد مشابهة

• The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
• Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
  بواسطة: Nahavandi, Mahdi
  منشور في: (2014)
• Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
  بواسطة: Muhammad Hafiz, Zan @ Hazizi
• Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7Cu lead-free solder alloy /
  بواسطة: Jaffery, Syed Hassan Abbas
  منشور في: (2017)
• The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /
  بواسطة: Angellia, Lian Dewi
  منشور في: (2009)