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Showing 1 - 20 results of 34 for search '"Solders"', query time: 0.02s Refine Results
  1. 1
    Wetting behaviors of lead based solders on various substrates at different temperatures /
    by Shaiful Anwar Ismail
    Published 2010
    Subjects: “...Solder and soldering....”
    Thesis Book
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  2. 2
    Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer /
    by Jannatun Adzura Adnan
    Published 2015
    Subjects: “...Solder and soldering....”
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  3. 3
    Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
    Subjects: “...Solder and soldering....”
    Thesis Book
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  4. 4
    Study on solder paste statistical process control (SPC) using vision inspection /
    by Chan, Gaik Tatt
    Published 1992
    Subjects: “...Solder and soldering. Automation....”
    Thesis Book
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  5. 5
    Material characterization of soft solder die attaches for power ICs /
    by Wee, Seng Kee
    Published 1996
    Subjects: “...Solder and soldering....”
    Thesis Book
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  6. 6
    Evaluation of corrosive environment impact on low cost fe/A1 added SAC105 solder alloys /
    by Nor Ilyana Muhd Nordin
    Published 2017
    Subjects: “...Solder and soldering....”
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  7. 7
    The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /
    by Angellia, Lian Dewi
    Published 2009
    Subjects: “...Solder and soldering....”
    Thesis Book
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  8. 8
    Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate /
    by Mahdavifard, Mohammad Hossein
    Published 2013
    Subjects: “...Solder and soldering....”
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  9. 9
    Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /
    by Leong, Yee Mei
    Published 2020
    Subjects: “...Solder and soldering....”
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  10. 10
    Analysis of selected lead-free solders by optical emission spectroscopy /
    by Yee, Chung Lee
    Published 2014
    Subjects: “...Solder and soldering....”
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  11. 11
    Ultrasonic assisted reflow soldering of lead free solder joint /
    by Tan, Ai Ting
    Published 2017
    Subjects: “...Solder and soldering....”
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  12. 12
    Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer /
    by Nashrah Hani Jamadon
    Published 2017
    Subjects: “...Solder and soldering....”
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  13. 13
    Electrodeposition and characterization of SN-BI lead-free soldier alloys /
    by Goh, Ying Xin
    Published 2015
    Subjects: “...Solder and soldering...”
    Thesis Book
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  14. 14
    Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate /
    by Ghosh, Sujan Kumer
    Published 2015
    Subjects: “...Solder and soldering....”
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  15. 15
    The electrical properties of element-added (FE, AL) lead-free solder alloys : experimental and materials modeling approaches /
    by Nur'aishah Aminah Mohd Amin
    Published 2015
    Subjects: “...Solder and soldering....”
    Thesis Book
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  16. 16
    Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7Cu lead-free solder alloy /
    by Jaffery, Syed Hassan Abbas
    Published 2017
    Subjects: “...Solder and soldering....”
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  17. 17
    Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor /
    by Mardiana Said
    Published 2022
    Subjects: “...Solder and soldering Design and construction....”
    Thesis Book
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  18. 18
    Thermal analysis of IC components undergoing solder reflow /
    by Chow, Seng Guan
    Published 1996
    Subjects: “...Solder and soldering....”
    Thesis Book
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  19. 19
    Effect of iron and bismuth addition on the microstructure and mechanical properties of SAC105 solder under severe thermal environment /
    by Ali, Bakhtiar
    Published 2017
    Subjects: “...Solder and soldering....”
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  20. 20
    Methodology of solder paste selection in semiconductor industry /
    by Govindasamy, Subramaniam D.
    Published 1996
    Subjects: “...Solder pastes....”
    Thesis Book
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