$Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders$

Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders

The aim of this thesis includes study the interfacial interactions of Lead-free solders (Pb-free) with the ENIG surface finish and its impact to brittle fracture of the solder joints. Selection of Pb-free solders through optimization the percentage composition of Sn-Ag-Cu solders and its alloying ad...

Saved in:

書目詳細資料
主要作者:	Chin, Yoong Tatt
格式:	Thesis
出版:	2014
主題:	TK7800-8360 Electronics
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

相似書籍

Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
由: Mohamed Anuar, Rabiatul Adawiyah
出版: (2017)

Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging
由: Yong, Su Kiat
出版: (2002)

Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
由: Mayappan, Ramani
出版: (2007)

Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering
由: Chung, Chee Key
出版: (2003)

Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
由: Chin, Yoong Tatt
出版: (2002)

Interfacial reactions during soldering of lead-free solders on copper and nickel substrates
由: Idris, Siti Rabiatull Aisha
出版: (2012)

Interfacial microstructure growth mechanism of lead-free solder using laser soldering
由: Muhammad Asyraf, Abdullah
出版: (2024)

Interfacial reactions between lead-free solders and electroless nickel
由: Mohd. Muzamir Mahat,
出版: (2009)

Model-Free Representations for Gait Recognition
由: Lee, Chin Poo
出版: (2015)

Study of interfacial reactions between lead-free solders and immersion silver finish
由: Oshaghi, Safoura
出版: (2008)

Lead Electromigration In Flip Chip Packaging Under Hast Environment
由: Wong, Shaw Hwang
出版: (2004)

Free Level Threshold Zone (FLTZ) Logic For Mixed Analog-Digital Closed Loop Circuitry [TK7887.6. N335 2008 f rb].
由: Nazem, Alireza
出版: (2007)

Blur Detection Technique For Thumbnail Image Generation
由: Koik , Boon Tatt
出版: (2015)

Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
由: Boo, Nan Shing
出版: (2010)

Investigation And Characterization Of Electrolyte For Fluidic Based Pressure Sensor
由: Fathi, Nur ‘Atiqah Ahmad
出版: (2015)

Investigation And Development Of Flattening Algorithms For Curved Latent Fingerprint Images
由: Chong, Bei Wei
出版: (2015)

Investigation of vehicle body radiation pattern as an antenna transmission system
由: Naidu, Dineshwaran
出版: (2015)

An investigation of circular and elliptical step-index fiber with helical winding
由: Narayanasamy Pillay, Shamini Pillay
出版: (2019)

Investigation on plasma properties for deposition of titanium nitride film using reactive magnetron sputtering system
由: Soo, Reh How
出版: (2018)

Investigation of fabricated tipspentacene based organic diode using slide coating deposition technique
由: Fara Naila Rusnan
出版: (2019)

Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
由: Binh, Duong Ngoc
出版: (2009)

Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
由: Abu Hassan, Nurfazlin
出版: (2009)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
由: Idris, Siti Rabiatull Aisha
出版: (2008)

Investigation On Inter-Layer Dielectric Processed By Chemical Mechanical Polishing And Spin-On Dielectric For Complementary Metal-Oxide-Semiconductor Compatible Devices
由: Mohd Saman, Rahimah
出版: (2016)

Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
由: Mohd. Yamin, Aliff Farhan
出版: (2012)

Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
由: Goh, Teck Joo
出版: (2004)

Modelling of thermal and charge/discharge cycle behaviors of nickel metal hydride (NI-MH) battery system
由: Mohammad Firdaus, Abu Hashim
出版: (2013)

Variability reduction in stencil printing of solder paste for surface mount technology
由: Ibrahim, Mustaffa
出版: (1998)

A Cost And Power Efficient Ddr4/Gddr5x/Gddr5 Transmitter With 3-Tap Equalizer
由: Ng , Hoong Chin
出版: (2016)

Design And Simulation Of Cmos Based Low Voltage Bandgap Reference Circuitry
由: Tan , Chin Ling
出版: (2016)

High Performance Current Amplifier [TK7871.58.P4 G896 2006 f rb] [Microfiche 8561].
由: Gu, Hock Chin
出版: (2006)

Harmonic reduction of a single-phase multilevel inverter using genetic algorithm and particle swarm optimization
由: Ling, Chin Wan
出版: (2016)

Private Biometrics Realisation Through Iris Verification
由: Chong, Siew Chin
出版: (2005)

Iris Recognition System With ID Fractal And Local Ordinal Measures Approaches
由: Teo, Chuan Chin
出版: (2007)

Investigation on Mlp Artificial Neural Network Using FPGA For Autonomous Cart Follower System
由: Liew, Yeong Tat_
出版: (2015)

Load Balancing Using The Consensus Control Algorithm For A Network Server System
由: Loon, Alan Tan Chin
出版: (2016)

Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].
由: Oo, Cheng Ee
出版: (2004)

investigation of interfacial reactions between nickel substrates and solders /
由: Liew, Siao Li
出版: (2002)

Ultrasonic assisted reflow soldering of lead free solder joint /
由: Tan, Ai Ting
出版: (2017)

Human odour detection approach using machine learning
由: Ahmed Qusay Sabri
出版: (2019)

Services hosted by the Perpustakaan Sultan Abdul Samad, Universiti Putra Malaysia with Cooperation MySyL Group