Recipe generation of under fill process based on improved kernel regression and particle swarm optimization
The under fill process is a process that fills the gap between a chipset and a substrate using an epoxy material. The output of this process is a length of tongue that has to be controlled so it avoid touching the keep out zone. A recipe generation of the input parameters in the under fill process w...
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| 格式: | Thesis |
| 语言: | English |
| 出版: |
2012
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| 主题: | |
| 在线阅读: | http://eprints.utm.my/id/eprint/33404/5/MohdHafizOthmanMFKE2012.pdf |
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